본문 바로가기

우진

메뉴버튼
Semiconductor Equipment

CMP Equipment

AMAT / EBARA CMP Equipment

  • F-Rex 200 / EPO

    ▶ 8 inch (200mm)
    ▶ Dry In & Dry Out
    ▶ Excellent Process Performance
    ▶ High stability / Convenient maintenance
    ▶ Chemical cleaning is possible
    ▶ Polish End Point Detect (Option)

    Item Specifications
    Configuration Number of TopRings 2
    Number of TurnTables 2
    Number of Cleaning Units 4
    Outline Dimensions (W*D*H   [mm]) 2000*3490*2450
  • F-Rex 300S / 300S2

    ▶ 12 inch (300mm)
    ▶ Dry In & Dry Out
    ▶ High Throughput
    ▶ Excellent Process Performance
    ▶ High stability / Convenient maintenance
    ▶ Chemical cleaning is possible
    ▶ Polish End Point Detect (Option)

    Item Specifications
    Configuration Number of TopRings 4
    Number of TurnTables 4
    Number of Cleaning Units 4
    Outline Dimensions (W*D*H   [mm]) 2300*4950*2850

CMP Equipment Refurbishment / Set-Up / Relocation / Disassemble / Trouble Shooting etc…